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学术报告告诉《Development of High-Performance Heat Sink Composite Material》-机器工程欧洲杯官网

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学术报告告诉《Development of High-Performance Heat Sink Composite Material》
日期:2020-11-18 点击:次

报告标题问题Development of High-Performance Heat Sink Composite Material

报告时候20201125日(周三)14301600

报告地址:机器馆J3报告厅

报告情势:长途视频

报告人:佐佐木 Sasaki Gen

报告人简介:

   佐佐木元毕业于日本西南大学,此刻这天本广岛大学大欧洲杯官网工学研讨科传授,博士生导师。首要的研讨标的目的:有关高功效高机能金属、陶瓷及金属基复合资料的物理景象的说明和开辟的研讨。专业范畴包含机器资料(金属基复合资料、陶瓷基复合资料、铝/镁等轻金属资料)、电子显微镜和X射线衍射的表征。今朝研讨的标的目的为高功效高机能金属、陶瓷及金属基复合资料的物理景象的说明和开辟。基于纳米亚微米尺寸级别下构造察看,构造定量化和操纵计较机摹拟的建模来指点加工工艺,从而完成对资料构造的调控。最新的研讨标的目的为付与标的目的性的高热传导金属基复合资料的开辟和热传导特征的实际评估。在Materials Science and Engineering A, Journal of Materials Processing Technology, Journal of Alloys and Compounds等国际期刊,日本金属学会志,粉体和粉末冶金,轻金属等日本国际期刊,和国际集会上颁发论文123篇。曾任日本粉体粉末冶金协会参事,日本锻造工程学会编辑委员会同业评审会员;现任日本复合资料学会理事,轻金属奖学会选考委员会选考委员,日本机器学会机器资料出产加工部扩展指点委员会委员,广岛市财产手艺增援参谋。并取得2016年日本机器工程师学会机器资料和资料加工分会机能奖。

报告内容简介:

With the rapid development of integration and miniaturization in electronic devices and circuitry, heat dissipation has emerged as a severe issue in recent years. It is well known poor heat dissipation will significantly despair the performance of electronic devices because of heat accumulation induced high temperature. Therefore, how to enhance the heat dissipation has become a hot research topic. All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. There are several techniques for releasing heat including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others, among which heat sinks are the most effective way to transfer heat. Heat conduction efficiency of heat sinks highly depends on the interfacial thermal resistance and intrinsic thermal conductivity of heat sink materials. Accordingly, we are focusing on developing different novel metal matrix composites (MMCs) with high performance as heat sink materials, since the microstructure of MMCs can be tailored in order to achieve high thermal conductivity as well as high performance. In this report, we will introduce some novel MMCs synthesized in our laboratory from the viewpoint of interfacial design, fraction and size tailoring of reinforcement, and computational simulation to further understand the mechanism of thermal enhancement of MMCs for the application of heat sink materials.

      *本报告由燕山大学引才引智国际协作培养名目帮助。

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